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Leading-edge logic chip (300 mm wafer → packaged AI accelerator)

unit: Per 300 mm leading-edge logic wafer (~3–5 nm) for the front end; per finished accelerator package for the back end

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SK Hynix

https://www.skhynix.com/ ↗

HBM memory stacks (with Samsung, Micron) · Icheon, South Korea

Overview

SK Hynix is the HBM leader — high-bandwidth memory is the back-end rail the naive chip chain omits, yet it often rivals or exceeds the logic-die cost in a finished accelerator.

The economics

Position in the chain

Supplies HBM stacks into TSMC CoWoS packaging alongside the logic die — see Inputs → HBM and the Overview Sankey.