Abstract

(Scaffold stub — extract pending the research pass.) BCG/SIA report mapping the global semiconductor value chain: where value concentrates across design, EUV equipment, materials, fabrication, and assembly/test, and the geographic concentration of each stage. Used here as an anchor for the value-chain breakdown; specific figures to be extracted and verified before any number is attributed to it.

Key claims

• value-chain-overview: Value is highly concentrated in a few stages (EDA/IP, equipment, leading-edge fab). (anchor placeholder — verify exact figures)
• energy-intensity: Polysilicon and front-end fabrication are energy-intensive steps. (anchor placeholder — verify)

Reviewer notes

This is a scaffold extract: the slug resolves so citations are wired, but the detailed claims must be fetched and verified by the auto-model research pass before specific numbers are sourced to this report.